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Frontiers of Mechanical Engineering >> 2021, Volume 16, Issue 3 doi: 10.1007/s11465-020-0624-0
Effects of taping on grinding quality of silicon wafers in backgrinding
. Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China.. CIMS Institute, School of Mechanical Engineering, Hefei University of Technology, Hefei 230009, China
Abstract
Keywords
taping ; silicon wafer ; backgrinding ; subsurface damage ; surface roughness
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